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Polymers | Free Full-Text | Microdrilling of Through-Holes in Flexible Printed Circuits Using Picosecond Ultrashort Pulse Laser | HTML
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Effects of processing parameters on the micro-drilling through fast hole electroerosion and laser trepanning in Inconel 718 | SpringerLink
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Water in contact with the backside of a silicon substrate enables drilling of high-quality holes through the substrate using ultrashort laser pulses
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